Density：8.5g/cm3 Electric conductivity(20 °C ): 27%IACS Thermal conductivity (20 °C): 120W/(m °C ) Elastic modulus: 105000N/mm2 Thermal expansion coefficient (20-300 °C ) 20 X 10 -6 °C -1
| Thickness | Width | Temper | Thickness Tolerances | Width Tolerances |
| 0.01~0.15 | 4～200 | O、1/4H、1/2H、H | ± 0.003 | Width Toler± 0.1ances |
| Temper | JIS Temper | Tensile Strength Rm/N/mm2 | Elongation A50/% | Hardness HV |
| M | O | 350~410 | ≥ 25 | 80~120 |
| Y4 | 1/4H | 375~445 | ≥ 15 | 105~145 |
| Y2 | 1/2H | 385~460 | ≥ 12 | 120~165 |
| Y | H | 450~510 | ≥ 5 | 135~185 |
| Nations | Standard No. | Standard Name |
| China | GB/T2059--2000 | CHINA’S NATIONAL STANDARD |
| Japan | JIS H3100 :2000 | COPPER AND COPPER ALLOY SHEETS,PLATES AND STRIPS |
| U.S.A | ASTM B36/B 36M -01 | STANDARD SPECIFICATION FOR BRASS,PLATE,SHEET,STRIP AND ROLLED BAR |
| Germany | DIN-EN 1652:1997 | COPPER AND COPPER ALLOYS PLATE,SHEET,STRIP AND CIRCLES FOR GENERAL PURPOSES |
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| DIN-EN 1758 :1997 | COPPER AND COPPER ALLOYS STRIP FOR LEADFRAMES |
| SEMI | SEMI G4-0302 | SPECIFICATION FOR INTERGRATED CIRCUIT LEADFRAME MATERIALS USED IN THE PRODUCTION OF STAMPED LEADFRAMES |